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Rigid And Flexible Laser PCB Depaneling Machine 10W Laser Power

Good quality Laser PCB Depaneling Machine for sales
Good quality Laser PCB Depaneling Machine for sales
We are are very satisfied with the quality of X-ray inspection machine, hope have a chance to cooperation again .

—— Mrs. Li

PP cutting machine is very good. Both the price and service are better than other companies .

—— Mr. Wang

Service attitude is very good, the effect is very good .

—— Mr. Zhou

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Rigid And Flexible Laser PCB Depaneling Machine 10W Laser Power

China Rigid And Flexible Laser PCB Depaneling Machine 10W Laser Power supplier

Large Image :  Rigid And Flexible Laser PCB Depaneling Machine 10W Laser Power

Product Details:

Place of Origin: China
Brand Name: ASIDA
Certification: CE
Model Number: JG18

Payment & Shipping Terms:

Minimum Order Quantity: 1Set
Price: Negotiation
Packaging Details: Wooden Carton
Delivery Time: 2Weeks
Payment Terms: T/T, L/C
Supply Ability: Negotiation
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Detailed Product Description
Laser Power: 10W Laser Wavelength: 355 Nm
XY Platform Maximum Operating Speed: 50m/min Weight: 3500kg
Repeat Accuracy: ±1µm Cutting Thickness: <1.0mm

 

Depaneling Of Rigid And Flexible PCB  Laser Cutting Equipment 10W Laser Power

 

 

Usage 


Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower. 

 

Characteristic 


1.  Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation. 
2.  Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously 
3.  Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall. 
4.  Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency. 
5.  Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc. 

6.  Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
 

 
Specifications
 
Item  Specification
MODEL JG18
Laser Source 355nm All-solid-state UV laser cutting device,wavelength 355nm
Laser Power 10W
Maximum Processing Size, 720mm×540 mm(21″×28″)
XY Platform Maximum Operating Speed 50m/min
Positioning accuracy ±3µm
Repeat accuracy ±1µm
System Processing Precision ±20µm
Galvanometer scanning range 50mm X 50mm
 Cutting Thickness ≤1mm
Power AC 220V/50Hz/2.2KW;380V/50Hz/5.5KW
Vacuum Requirements 516m3/h
Overall Dimensions 1818mm×2317 mm×1550 mm
Weight 3500kg
Environmental Temperature 20ºC±1ºC
Humidity <60%RH (No dew)
Ground Amplitude <5µm
Vibration Acceleration <0.05G
Ground Pressure 2200kgf/m2

 

 

Rigid And Flexible Laser PCB Depaneling Machine 10W Laser Power 

Contact Details
GUANGDONG ZHENGYE  TECHNOLOGY CO.,LTD.

Contact Person: Miss. Anna

Tel: +86-769 8898 5065

Fax: 86-769-8898-5777

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