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Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB

Good quality Laser PCB Depaneling Machine for sales
Good quality Laser PCB Depaneling Machine for sales
We are are very satisfied with the quality of X-ray inspection machine, hope have a chance to cooperation again .

—— Mrs. Li

PP cutting machine is very good. Both the price and service are better than other companies .

—— Mr. Wang

Service attitude is very good, the effect is very good .

—— Mr. Zhou

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Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB

China Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB supplier
Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB supplier Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB supplier

Large Image :  Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB

Product Details:

Place of Origin: China
Brand Name: ASIDA
Certification: CE,ISO,UL,SGS
Model Number: JG32

Payment & Shipping Terms:

Minimum Order Quantity: 1 SET
Price: Negotiations
Packaging Details: wooden carton
Delivery Time: 5 work days
Payment Terms: T/T, L/C
Supply Ability: 20 sets per month
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Detailed Product Description
Laser Source: Picoseconde Laser Laser Processing Size: 550mm × 550mm
Processing Accuracy: 20μm Laser Power: 15W
Keyword: Picosecond Laser Micromachining Systems Application: Cover Layer, Ceramic, Silicon,aluminium Foil, Teflon Etc

Precision 355-nm Picosecond Laser Cutting Equipment for Ceramic PCB

 

 

Drilling of Ceramics (AlO, AlN, etc.) ƒ

Percussion Drilling / Trepanning with Scanner Optics ƒ

Diameters < 100 µm – X mm ƒ Low HAZ ƒ

No Chipping/Cracking ƒ

Applications: Ceramic PCB

 


 

 

Picoseconde Laser Cutting Machine Usage:

 

The machine is mainly used for cover layer (CVL) cutting, flexible board (FPC) outline cutting, rigid-flexible circuit board (RF) cutting ,and thin multi -layer board cutting, as well as ceramics, silicon, aluminum foil, teflon, etc..

 

Picoseconde Laser Cutting Machine Features:

 

1, Less carbonization:

laser pulse width is less than 10 picosecond, thermal influence is minimum,so the carbonization is little.

 

2, High speed:

picosecond repetition frequency is very high and galvanometer speed is up to 3000mm / s,so cutting speed of pico laser machine is double compared with nanosecond laser cutting machine.

 

3, Good cutting effect:

Pico laser machine process with a small single pulse energy, high frequency processing, so processing surface is more smooth;

 

4,Applied for various materials

Cover layer,circuit board,copper foil ,ceramics, silicon, Teflon, display glass,etc.

 

 

Picoseconde Laser Cutting Machine Applications:

 

Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.

 

 

Picoseconde Laser Cutting Machine Specifications:

 

Specification of picosecond laser cutting machine
Applied Range FPC,CVL,FPC, micro-connection, ceramics, silicon and so on
System Processing Accuracy

( ZHENGYE Conditions)

±20μm

Laser power 15W@400kHz
Laser Wavelength 355nm
Pulse Width 10ps
Frequency Range 4kHz-1MHz
Objects Large processing size 550mmX650mm
Table number Single beam, Dual platform
Dimensions (L×W×H) 2200mm×2150mm×1750mm
Weight 3700kg

 

Cutting Samples

Precision 355nm Picosecond Laser Cutting Equipment For Ceramic PCB

 

 

 

 

 

 

 

 

   

Contact Details
GUANGDONG ZHENGYE  TECHNOLOGY CO.,LTD.

Contact Person: Miss. Anna

Tel: 86-769-8898-5065

Fax: 86-769-8898-5777

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