Payment & Shipping Terms:
|Laser Source:||Picoseconde Laser||Laser Processing Size:||550mm × 550mm|
|Processing Accuracy:||20μm||Laser Power:||15W|
|Keyword:||Picosecond Laser Micromachining Systems||Application:||Cover Layer, Ceramic, Silicon,aluminium Foil, Teflon Etc|
Precision 355-nm Picosecond Laser Cutting Equipment for Ceramic PCB
Drilling of Ceramics (AlO, AlN, etc.)
Percussion Drilling / Trepanning with Scanner Optics
Diameters < 100 µm – X mm Low HAZ
Applications: Ceramic PCB
Picoseconde Laser Cutting Machine Usage:
The machine is mainly used for cover layer (CVL) cutting, flexible board (FPC) outline cutting, rigid-flexible circuit board (RF) cutting ,and thin multi -layer board cutting, as well as ceramics, silicon, aluminum foil, teflon, etc..
Picoseconde Laser Cutting Machine Features:
1, Less carbonization:
laser pulse width is less than 10 picosecond, thermal influence is minimum,so the carbonization is little.
2, High speed:
picosecond repetition frequency is very high and galvanometer speed is up to 3000mm / s,so cutting speed of pico laser machine is double compared with nanosecond laser cutting machine.
3, Good cutting effect:
Pico laser machine process with a small single pulse energy, high frequency processing, so processing surface is more smooth;
4,Applied for various materials
Cover layer,circuit board,copper foil ,ceramics, silicon, Teflon, display glass,etc.
Picoseconde Laser Cutting Machine Applications:
Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.
Picoseconde Laser Cutting Machine Specifications:
|Specification of picosecond laser cutting machine|
|Applied Range||FPC,CVL,FPC, micro-connection, ceramics, silicon and so on|
|System Processing Accuracy||
( ZHENGYE Conditions)
|Objects||Large processing size||550mmX650mm|
|Table number||Single beam, Dual platform|